AIM Products

Ceramic Whiskers

AIM produces ceramic whiskers of silicon carbide, tantalum carbide, niobium carbide, and other transition metal carbides, carbonitrides, and nitrides. Ceramic whiskers, for readers unfamiliar with this technology, are single crystal discontinuous fibers (often called short fibers). They are typically 1 micron in diameter and 100 microns in length, although these parameters can vary over a considerable range. A characteristic feature of whiskers is their high strength--measured in millions of psi (around 10 GPa) in tension. This is near the theoretical maximum for the covalent bonds that bind the atoms in the crystal.

Whiskers are used in ceramic composites for cutting tools, heat engine parts, bearings, rollers and other parts in which wear-resistance is necessary. These composites have outstanding thermal stability, strength and fracture toughness. Whiskers are also used to make metal matrix composites and polymer matrix composites. Many applications for improved polymer adhesives are made possible through the high thermal conductivity of silicon carbide, the high electrical conductivity of some of the transition metal whiskers, and the high strength of whiskers.

AIM has developed a set of standard whiskers whose properties are listed in a table of ceramic whiskers. We can also work with you to develop custom whiskers for your application. Interested? Contact us through our inquiry form.

Powders and Materials

High quality advanced materials require appropriate starting powders. AIM uses a number of powder preparation approaches including sol-gel and carbothermal synthesis, followed by grinding, spray drying, heat treating, and other processing as appropriate, to refine the powder properties. We prepare equiaxed powders as well as ceramic whiskers, and we combine whiskers and powders for ready-to-use composite compositions. We also work with clients to develop advanced materials for their special applications. We prepare the materials by isostatic pressing and sintering, or by vacuum hot pressing.

Electronic Materials

Hybrid microelectronics applications often require substrates and packages with tailored electrical and thermal properties. AIM meets these needs by preparing custom powders and parts. Hot pressing is particularly effective in preparing electronic substrates and packages. Additionally, we make special thick-film pastes and additives for improved electrical, thermal or mechanical properties of microelectronics polymers. We provide materials engineering consulting services and we participate in long term projects to develop advanced electronic materials.